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Campus Teisnach

SENSOR TECHNOLOGY. PACKAGING & ADVANCED MATERIALS, INTEGRATED OPTICS, SECURE DIGITALISATION

The Campus Teisnach Sensor Technology is a research institution of the Deggendorf Institute of Technology (DIT) and bundles the know-how of DIT in the following areas:

  • Sensor integration into existing machines and plants
  • Data analysis using machine learning methods
  • Development of application-specific assembly and connection technoloty (including special materials such as glass, ceramics, etc.)
  • New sensor materials and applications
  • Development of new sensor concepts for industrial applications
  • Design and implementation of holistic IT security strategies (IT and OT)

About the campus Teisnach

For small and medium-sized enterprises, it can be very difficult to test new product ideas in the field of sensor technology. They often lack the specialist equipment required, for example for depositing special coatings, or the development of assembly and connection technology has to be outsourced, which usually only pays off for larger production runs. Furthermore, the secure integration of sensors plays a crucial role in companies’ digitalisation strategies.

It was against this backdrop that the idea arose for a new campus at Deggendorf Institute of Technology to tackle this challenge. Thus, in January 2018, the NEPROMUK project (Industry 4.0 Network Centre for Modern Production, Measurement and Communication Technologies for Industry and Skilled Trades) – a joint project between the market town of Teisnach and Deggendorf Institute of Technology – the Teisnach II Technology Transfer Centre will launch under the name Technology Campus Teisnach Sensor Technology (TCTS), later to be known as Campus Teisnach Sensor Technology.

Our vision is to enhance the competitiveness of local businesses through technology transfer. As a network hub in the fields of integrated optics, the application and secure integration of sensors into existing production processes, and the development of new materials in the field of sensor technology, we support our partners.

expertise

To this end, there are currently two research groups based at the Teisnach Campus Sensor Technology, which focus on the following areas.

Packaging und Advanced Materials

Industrial sensor technology is now finding its way into an ever-increasing number of technical and commercial systems. Given the wide range of potential applications, there is a growing demand for systems tailored to specific requirements.

However, particularly in the field of development or for specialised applications (high temperatures, harsh environments), such systems are rarely available or difficult to source.

With our expertise and equipment in micro-machining, we offer innovative and application-oriented solutions in the field of sensor packaging, starting from a quantity of just one unit, as part of research projects or as a service. The range of materials we can machine extends from plastics and non-ferrous metals through hardened steels and hard metals to technical ceramics and glasses. In addition, further facilities are available for the construction of fixtures and test setups, enabling an efficient workflow with short distances and rapid response times.

The development of new sensors that are also more reliable in harsh environments often requires the use of innovative, bespoke materials, such as functional sensor layers made from 2D materials or durable protective coatings. For research and development projects, facilities for the deposition and processing of a wide variety of materials are available here. Among other things, a pulsed laser deposition (PLD) system, a sputtering deposition system (PVD) and various plasma deposition systems are installed. The equipment is complemented by an extensive range of analytical instruments for characterising these materials and for investigating failure mechanisms relevant to reliability. Among other things, a scanning electron microscope (SEM/EDX), an X-ray photoelectron spectrometer (XPS), a Raman spectrometer, a laser scanning microscope (LSM) and numerous other analytical methods are available.

Integrated Optics

Our team of physicists and engineers develops innovative glass-based components. The focus is on light-guiding components at the micrometre scale that can be directly coupled to fibre-optic cables and deliver exceptionally high optical quality. Current areas of research include, for example, sensor technology for depth-resolved material characterisation, structural health monitoring, and data communication applications.

To this end, we design and produce micro-optical components and systems. Among other methods, we utilise ion exchange processes to selectively increase the refractive index of the glass. Every step, from preliminary studies through design and manufacture to validation, is supported by simulations. This enables the creation of optical distribution components with extremely low signal loss, as well as miniaturised sensor applications.

In addition to the manufacturing process steps, characterisation is also of essential importance. Here, we rely on our expertise in the construction and operation of optical measuring instruments. For example, we use an RNF measuring instrument developed in-house to determine refractive index profiles. Both the control system and the interface were programmed by us in Python.

We also have the capability to 3D-print prototypes, polish surfaces and precision-machine optical components using our 5-axis ultrashort-pulse laser.
Of particular note here is our nano 3D printer, which utilises two-photon polymerisation, enabling us to produce optical prototypes quickly and with a high degree of flexibility.

Thanks to our high-tech equipment and our expertise in simulation, theory and experimentation, we are well prepared to tackle any challenges in the field of micro-optics and look forward to hearing from you!

projects

Publications, Presentations and Patents

The following publications database provides an overview of the publications of the staff of the Technology Campus Sensor Technology in German. A search is possible by author, organisational unit and publication type as well as by free text entry.

directions

Campus Teisnach Sensor Technology

Technologiecampus 3
94244 Teisnach

+49 (0)9923 - 80108 - 500

info.tc-teisnach-sensorik@th-deg.de